FOB Price
Get Latest Price( Negotiable )
|1 Piece Minimum Order
Country:
China
Model No:
-
FOB Price:
( Negotiable ) Get Latest Price
Place of Origin:
china
Price for Minimum Order:
-
Minimum Order Quantity:
1 Piece
Packaging Detail:
box
Delivery Time:
5-10days
Supplying Ability:
3000 Piece per Month
Payment Type:
D/A, L/C, T/T
Product Group :
-
Contact Person Mr. Anna
Zhengzhou,Henan,China, Zhengzhou, Henan
Silicon wafer back grinding wheels are
mainly used for the thinning and fine grinding of the silicon
wafer.
Coolant: Oil, emulsion
whatsapp *********8/***3
workpiece processed: silicon wafer of
discrete devices, integrated chips (IC) and
virgin,ATM, Melchiorre, Peter Wolters, Diskus, Viotto,
Wendt
Material of workpiece: monocrystalline
silicon and some other semiconductor materials.
Specifications
1.be used with Japanese, German, American,
Korea and Chinese grinders
2.superior grinding
performance
3.high cost performance
| Shape code | Profile Sketch | Conventional Specification (mm) | ||
| Out diameter D |
Thickness T |
Hole diameter H | ||
| 6A2 | **5 | *0, *5 | *6 | |
| **0 | *5 | *6 | ||
| **5 | *0 | **7 | ||
| 6A2T | **5 | *2.5, *5 | **0 | |
| **0 | *0 | **8.6 | ||
| **0 | *5 | **5 | ||
| 6A2T- | **9 | *2.5 | **8 | |
| Country: | China |
| Model No: | - |
| FOB Price: | ( Negotiable ) Get Latest Price |
| Place of Origin: | china |
| Price for Minimum Order: | - |
| Minimum Order Quantity: | 1 Piece |
| Packaging Detail: | box |
| Delivery Time: | 5-10days |
| Supplying Ability: | 3000 Piece per Month |
| Payment Type: | D/A, L/C, T/T |
| Product Group : | - |
