Product Description

HAL Specification: Sn/Pb thickness: ***5um Sn/Pb proportion: *3:*7 Shelf life: *4 months Characteristics: Very good wetting ability Proven method Chemical Data： Layers：***6 Layers *****：**0X**0mm Board Thickness：0.2mm*5.0mm Minimum Trace Width：0.1mm Minimum Trace Clearance：0.1mm Minimum Hole Diameter： 0.2mm Hole Plating Thickness：≥*5um PTH Hole Tolerance： ≤0.8mm Plus or Minus 0.*5mm ＞0.8mm Plus or Minus 0.1mm Hole Position Deviation：Plus or Minus 0.*5mm Outline Tolerance：Plus or Minus 0.*3mm Insulation Resistance：***2 Ω Through Hole Resistance：≤ **0 UΩ Dialectric Strength：≥1.6 kv/mm Current Breakdown：*0A Peel Off Strength：1.5N/mm Solder Mask Abrasion：＞5H Thermal Strength：**8℃/3X per *0 seconds Inflammability ：UL *4V*0 E-Test Voltage：*****0V Pull Off Strength of Pads：＞**0N Solder Ability：**5 Degrees Celsius Withing 3 seconds Bow and Twist：＜0.*1mm/mm