NIHON SUPERIOR

Nihon Superior was founded in ***6 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN**0C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.

Nihon Superior (Singapore) Pte. Ltd., subsidiary of Nihon Superior Co. Ltd. (Osaka, Japan), a supplier of advanced soldering and brazing materials to the global market.Most of these products are based on the companys well known silver-free and lead-free solder SN**0C® which now has a track record of more than *3 years successful delivery of high productivity and high reliability. However there are also some products that have emerged from Nihon Superiors exploration of new alloys and new technologies. Although at **7°C the melting point of SN**0C is higher than that of high-silver lead-free solders SN**0C solder pastes can usually be reflowed with a profile similar to that commonly used with SAC**5 and SAC**5 with a **0°C peak.
 
SN**0C Bar and Solid Wire for Wave and Selective Soldering
SN**0C revolutionized lead-free wave soldering by making it possible to get soldering performance and joint appearance similar to that of tin-lead solder without the expensive addition of silver. This was achieved with the addition of nickel which also provided the benefit of low copper dissolution and a stable slow-growing intermetallic. SN**0C is already being used in more than ***0 wave and selective soldering machines around the world with more machines being commissioned every month.
 
SN**0C Bar for Hot Air Solder Leveling (HASL)
HASL was the most widely used PCB finish in the era of tin-lead soldering because nothing solders like solder and with SN**0C it is possible to continue using that finish in the lead-free era. The high fluidity and surface tension of SN**0C imparted by the nickel addition means that the HASL coating is more uniform than tin-lead HASL so that coplanarity problems are minimized. The finish is smooth and bright and has the great advantage over other lead-free PCB finishes such as immersion silver and OSP that it does not require special packaging and storage conditions.

Solder Paste for High Density Assembly
SN**0C P**0is a high-reliability halogen-activated no-clean lead-free solder paste optimized to
deliver good reflow with chip components down to ****5 (***2 metric). SN**0C P**0 improves the joint quality of densely populated boards with fillet less, small solder volume chip components and fine-pitch mounting in which a reduction in joint strength is a concern due to
the very small joint size.
General Purpose Flux-Cored Solder Wire
SN**0C (**0)is a high-reliability halogen-activated no-clean flux-cored lead-free solder wire.
2ndGeneration Completely-Halogen-Free Soldering Materials
Nihon Superior is committed to supporting the electronics industrys drive to eliminate environmentally-damaging halogens and these new products deliver an even higher level of performance in terms of wetting and fillet formation. These halogen-free materials contain no additions of F, Cl, Br or I but still have excellent soldering performance. For Reflow Soldering
SN**0C P**2 D4printing grade solder paste
SN**0C P**3 D4and SN**0C P**5 D6dispensing grade pastes for chip components down to ***2 metric.These solder pastes have high activity for good wetting of terminations and reduced mid-chip balling resulting in excellent solderability while delivering the high reliability of SN**0C.
Wave Soldering Flux
NS-F**0is a robust halogen-free wave soldering flux that wets even oxidized copper delivering excellent barrel fill and minimizes bridging by facilitating drainage as the joints exit the wave.
 
SN**0C Advantage Series
This new series of alloys builds on the advantages of the tin-copper-nickel system to create new alloys that provide performance advantages in particular applications.
SN*9CN,the first alloy in this series, has a controlled addition of silver to deliver improved impact strength on both copper and nickel substrates. The alloy still enjoys the benefit of the nickel stabilization so the intermetallic that forms on copper substrates grows only slowly in elevated temperature service and remains smooth. SN*9CN is available as spheres and SN*9CN P**2 D4solder paste.
 
High Temperature Solder
SN**0C7Ais a high temperature solder for the assembly of power modules that operate at elevated temperatures. The fine grain size of the intermetallic ensures good mechanical properties.
 
Replacing Copper with Aluminum
With appropriate adjustment of dimensions aluminum can provide the same electrical and thermal conductivity as copper at a significantly lower material cost. As such it is a candidate for replacing copper in applications such as heating, ventilation and air conditioning systems (HVAC), heat sinks, heat pipes and motor windings. Nihon Superior is now offering solutions to the poor solderability of aluminum alloys that has limited their used in such applications Solder-Coated Aluminum Ribbon for Solar Cell Tabbing
Applying a coating of SN**0C to the aluminum ribbon means that it can be soldered to the silver metallization of solar cells in the same way as the tin-coated copper ribbon currently used in that application
Flux for Soldering Aluminum
Aluminum soldering flux ***1 makes it possible to achieve a strong reliable joint to commonly used aluminum alloys.
 
Tin-Zinc Solder
LF-Z3 PF**4 D3halogen-free solder paste is based on the tin-zinc eutectic suitable for soldering silver substrates such as fired silver pads on glass substrates. The peak reflow temperatures of approximately **5°C is *5°C lower than that of SAC**5 and the alloy has much less tendency to erode the silver . PF**4 flux medium is especially formulated to avoid degradation of the paste so that a stable viscosity can be maintained during storage.
For any further product details or query please Contact:
NIHON SUPERIOR (SINGAPORE) PTE. LTD.
*2 LITTLE ROAD, #****1 LIAN CHEONG INDUSTRIAL BUILDING, SINGAPORE *****6
Tel: **5 ***1 ***3
Fax: **5 ***1 ***6
E-mail:/sachin